Power surface mount light emitting die package

ABSTRACT

A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of and claims priority to U.S. patentapplication Ser. No. 11/689,868 entitled “Power Surface Mount LightEmitting Die Package” filed Mar. 22, 2007, which is a continuation ofU.S. patent application Ser. No. 10/692,351 entitled “Power SurfaceMount Light Emitting Die Package” filed Oct. 22, 2003, now U.S. Pat. No.7,244,965, which is a continuation-in-part of U.S. patent applicationSer. No. 10/446,532 entitled “Power Surface Mount Light Emitting DiePackage” filed May 27, 2003, now U.S. Pat. No. 7,264,378, which claimsthe benefit of U.S. Provisional Application Ser. No. 60/408,254 filedSep. 4, 2002. The entire contents of the above applications and patentsare incorporated by reference herein.

BACKGROUND

Example embodiments in general relate to packaging semiconductor deviceswhich include light emitting diodes.

Light emitting diodes (LEDs) are often packaged within leadframepackages. A leadframe package typically includes a molded or castplastic body that encapsulates an LED, a lens portion, and thin metalleads connected to the LED and extending outside the body. The metalleads of the leadframe package serve as the conduit to supply the LEDwith electrical power and, at the same time, may act to draw heat awayfrom the LED. Heat is generated by the LED when power is applied to theLED to produce light. A portion of the leads extends out from thepackage body for connection to circuits external to the leadframepackage.

Some of the heat generated by the LED is dissipated by the plasticpackage body; however, most of the heat is drawn away from the LED viathe metal components of the package. The metal leads are typically verythin and has a small cross section. For this reason, capacity of themetal leads to remove heat from the LED is limited. This limits theamount of power that can be sent to the LED thereby limiting the amountof light that can be generated by the LED.

To increase the capacity of an LED package to dissipate heat, in one LEDpackage design, a heat sink slug is introduced into the package. Theheat sink slug draws heat from the LED chip. Hence, it increases thecapacity of the LED package to dissipate heat. However, this designintroduces empty spaces within the package that is be filled with anencapsulant to protect the LED chip. Furthermore, due to significantdifferences in CTE (coefficient of thermal expansion) between variouscomponents inside the LED package, bubbles tend to form inside theencapsulant or the encapsulant tends to delaminate from various portionswithin the package. This adversely affects the light output andreliability of the product. In addition, this design includes a pair offlimsy leads which are typically soldered by a hot-iron. Thismanufacturing process is incompatible with convenient surface mountingtechnology (SMT) that is popular in the art of electronic boardassembly.

In another LED package design, the leads of the leadframe package havediffering thicknesses extended (in various shapes and configurations)beyond the immediate edge of the LED package body. A thicker lead isutilized as a heat-spreader and the LED chip is mounted on it. Thisarrangement allows heat generated by the LED chip to dissipate throughthe thicker lead which is often connected to an external heat sink. Thisdesign is inherently unreliable due to significant difference incoefficient of thermal expansion (CTE) between the plastic body and theleadframe material. When subjected to temperature cycles, its rigidplastic body that adheres to the metal leads experiences high degree ofthermal stresses in many directions. This potentially leads to variousundesirable results such as cracking of the plastic body, separation ofthe plastic body from the LED chip, breaking of the bond wires,delaminating of the plastic body at the interfaces where it bonds tovarious parts, or resulting in a combination of these outcomes. Inaddition, the extended leads increase the package size and itsfootprint. For this reason, it is difficult to populate these LEDpackages in a dense cluster on a printed circuit board (PCB) to generatebrighter light.

Another disadvantage of conventional leadframe design is that the thicklead cannot be made or stamped into a fine circuit for flip-chipmounting of a LED—which is commonly used by some manufacturers forcost-effective manufacturing and device performance.

SUMMARY

An example embodiment of the present invention is directed to a lightemitting die package. The package includes a substrate having a firstsurface and a first conductive lead on the first surface that isinsulated from the substrate by an insulating film. The first conductivelead forms a mounting pad for mounting a light emitting device. Thepackage includes a lead electrically connected to the first conductivelead and extending away from the first surface.

Another example embodiment is directed to a light emitting die package.The package includes a substrate having a first surface and a secondsurface opposite the first surface, a via hole through the substrate,and a conductive lead extending from the first surface to the secondsurface. The conductive lead is insulated from the substrate by aninsulating film. The package includes a metal contact pad on one of thefirst and second surfaces electrically connected to the conductive lead.The metal contact pad has a light emitting diode (LED) mounted thereon.

Another example embodiment is directed to a LED package including asubstrate having a first surface, a second surface opposite the firstsurface, and a first conductive lead on the first surface that isinsulated from the substrate by a first insulating film. The firstconductive lead forms a mounting pad for mounting a light emittingdevice. The package includes at least one via hold formed through thesubstrate. A surface of the via hole is coated with a second insulatingfilm.

Another example embodiment is directed to a LED package including asubstrate having a top surface, a bottom surface, at least oneconductive element on the top surface connected to a LED and at leastone conductive element attached to the bottom surface. The packageincludes at least two via, holes formed through the substrate. Each viahole includes an electrical conductor therein which electricallyconnects the at least one conductive elements on the top and bottomsurfaces of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will become more fully understood from the detaileddescription given herein below and the accompanying drawings, whereinlike elements are represented by like reference numerals, which aregiven by way of illustration only and thus are not limitative of theexample embodiments.

FIG. 1A is a perspective view of a semiconductor die package accordingto one embodiment of the present invention.

FIG. 1B is an exploded perspective view of the semiconductor package ofFIG. 1A.

FIG. 2A is a top view of a portion of the semiconductor package of FIG.1A.

FIG. 2B is a side view of a portion of the semiconductor package of FIG.1A.

FIG. 2C is a front view of a portion of the semiconductor package ofFIG. 1A.

FIG. 2D is a bottom view of a portion of the semiconductor package ofFIG. 1A.

FIG. 3 is a cut-away side view of portions of the semiconductor packageof FIG. 1A.

FIG. 4 is a side view of the semiconductor package of FIG. 1A withadditional elements.

FIG. 5 an exploded perspective view of a semiconductor die packageaccording to another embodiment of the present invention.

FIG. 6A is a top view of a portion of the semiconductor package of FIG.5.

FIG. 6B is a side view of a portion of the semiconductor package of FIG.5.

FIG. 6C is a front view of a portion of the semiconductor package ofFIG. 5.

FIG. 6D is a bottom view of a portion of the semiconductor package ofFIG. 5.

FIG. 7A is a top view of a portion of a semiconductor package accordingto another example embodiment.

FIG. 7B is a front view of the portion of a semiconductor package ofFIG. 7A.

FIG. 7C is a cut-away front view of the portion of a semiconductorpackage of FIG. 7A taken along line A-A.

FIG. 8 is a side view of a portion of a semiconductor package accordingto another example embodiment.

FIG. 9 is a side view of a portion of a semiconductor package accordingto another example embodiment.

FIG. 10A is a top view of a portion of a semiconductor package accordingto another example embodiment.

FIG. 10B is a top view of a portion of a semiconductor package accordingto another example embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described with reference to FIGS. 1through 10B. As illustrated in the Figures, the sizes of layers orregions are exaggerated for illustrative purposes and, thus, areprovided to illustrate the general structures of the present invention.Furthermore, various aspects in the example embodiments are describedwith reference to a layer or structure being formed on a substrate orother layer or structure. As will be appreciated by those of skill inthe art, references to a layer being formed “on” another layer orsubstrate contemplates that additional layers may intervene. Referencesto a layer being formed on another layer or substrate without anintervening layer are described herein as being formed “directly on” thelayer or substrate.

Furthermore, relative terms such as beneath may be used herein todescribe one layer or regions relationship to another layer or region asillustrated in the Figures. It will be understood that these terms areintended to encompass different orientations of the device in additionto the orientation depicted in the Figures. For example, if the devicein the Figures is turned over, layers or regions described as “beneath”other layers or regions would now be oriented “above” these other layersor regions. The term “beneath” is intended to encompass both above andbeneath in this situation. Like numbers refer to like elementsthroughout.

As shown in the figures for the purposes of illustration, exampleembodiments of the present invention are exemplified by a light emittingdie package including a bottom heat sink (substrate) having traces forconnecting to a light emitting diode at a mounting pad and a top heatsink (reflector plate) substantially surrounding the mounting pad. Alens covers the mounting pad. In effect, an example die packagecomprises a two part heat sink with the bottom heat sink utilized (inaddition to its utility for drawing and dissipating heat) as thesubstrate on which the LED is mounted and connected, and with the topheat sink utilized (in addition to its utility for drawing anddissipating heat) as a reflector plate to direct light produced by theLED. Because both the bottom and the top heat sinks draw heat away fromthe LED, more power can be delivered to the LED, and the LED can therebyproduce more light.

Further, the body of the die package itself may act as the heat sinkremoving heat from the LED and dissipating it. For this reason, theexample LED die package may not require separate heat sink slugs orleads that extend away from the package. Accordingly, the LED diepackage may be more compact, more reliable, and less costly tomanufacture than die packages of the prior art.

FIG. 1A is a perspective view of a semiconductor die package 10according to one embodiment of the present invention and FIG. 1B is anexploded perspective view of the semiconductor package of FIG. 1A.Referring to FIGS. 1A and 1B, the light emitting die package 10 of thepresent invention includes a bottom heat sink 20, a top heat sink 40,and a lens 50.

The bottom heat sink 20 is illustrated in more detail in FIGS. 2Athrough 2D. FIGS. 2A, 2B, 2C, and 2D provide, respectively, a top view,a side view, a front view, and a bottom view of the bottom heat sink 20of FIG. 1A. Further, FIG. 2C also shows an LED assembly 60 in additionto the front view of the bottom heat sink 20. The LED assembly 60 isalso illustrated in FIG. 1B. Referring to FIGS. 1A through 2D, thebottom heat sink 20 provides support for electrical traces 22 and 24;for solder pads 26, 32, and 34; and for the LED assembly 60. For thisreason, the bottom heat sink 20 is also referred to as a substrate 20.In the Figures, to avoid clutter, only representative solder pads 26,32, and 34 are indicated with reference numbers. The traces 22 and 24and the solder pads 32, 34, and 36 can be fabricated using conductivematerial. Further, additional traces and connections can be fabricatedon the top, side, or bottom of the substrate 20, or layered within thesubstrate 20. The traces 22 and 24, the solder pads 32, 34, and 36, andany other connections can be interconnected to each other in anycombination using known methods, for example via holes.

The substrate 20 is made of material having high thermal conductivitybut is electrically insulating, for example, aluminum nitride (AIN) oralumina (Al.sub.2O.sub.3). Dimensions of the substrate 20 can varywidely depending on application and processes used to manufacture thedie package 10. For example, in the illustrated embodiment, thesubstrate 20 may have dimensions ranging from fractions of millimeters(mm) to tens of millimeters. Although the present invention is notlimited to particular dimensions, one specific embodiment of the diepackage 10 of the present invention is illustrated in Figures with thedimensions denoted therein. All dimensions shown in the Figures are inmillimeters (for lengths, widths, heights, and radii) and degrees (forangles) except as otherwise designated in the Figures, in theSpecification herein, or both.

The substrate 20 has a top surface 21, the top surface 21 including theelectrical traces 22 and 24. The traces 22 and 24 provide electricalconnections from the solder pads (for example top solder pads 26) to amounting pad 28. The top solder pads 26 are portions of the traces 22and 24 generally proximal to sides of the substrate 20. The top solderpads 26 are electrically connected to side solder pads 32. The mountingpad 28 is a portion of the top surface (including portions of the trace22, the trace 24, or both) where the LED assembly 60 is mounted.Typically the mounting pad 28 is generally located proximal to center ofthe top surface 21. In alternative embodiments of the present invention,the LED assembly 60 can be replaced by other semiconductor circuits orchips.

The traces 22 and 24 provide electrical routes to allow the LED assembly60 to electrically connect to the solder pads 26, 32, or 34.Accordingly, some of the traces are referred to as first traces 22,while other traces are referred to as second traces 24. In theillustrated embodiment, the mounting pad 28 includes portions of boththe first traces 22 and the second traces 24. In the illustratedexample, the LED assembly 60 is placed on the first trace 22 portion ofthe mounting pad 28 thereby making contact with the first trace 22. Inthe illustrated embodiment, a top of the LED assembly 60 and the secondtraces 24 are connected to each other via a bond wire 62. Depending onthe construction and orientation of LED assembly 60, first traces 22 mayprovide anode (positive) connections and second traces 24 may comprisecathode (negative) connections for the LED assembly 60 (or vice versa).

The LED assembly 60 can include additional elements. For example, inFIGS. 1B and 2C, the LED assembly 60 is illustrated including an LEDbond wire 62, an LED subassembly 64, and a light emitting diode (LED)66. Such an LED subassembly 64 is known in the art and is illustratedfor the purposes of discussing the invention and is not meant to be alimitation of the present invention. In the Figures, the LED assembly 60is shown die-attached to the substrate 20. In alternative embodiments,the mounting pad 28 can be configured to allow flip-chip attachment ofthe LED assembly 60. Additionally, multiple LED assemblies can bemounted on the mounting pad 28. In alternative embodiments, the LEDassembly 60 can be mounted over multiple traces. This is especially trueif flip-chip technology is used.

The topology of the traces 22 and 24 can vary widely from the topologyillustrated in the Figures while still remaining within the scope of theexample embodiments of the present invention. In the Figures, threeseparate cathode (negative) traces 24 are shown to illustrate that threeLED assemblies can be placed on the mounting pad 28, each connected to adifferent cathode (negative) trace; thus, the three LED assemblies maybe separately electrically controllable. The traces 22 and 24 are madeof conductive material such as gold, silver, tin, or other metals. Thetraces 22 and 24 can have dimensions as illustrated in the Figures andare of a thickness on the order of microns or tens of microns, dependingon application. In an example, the traces 22 and 24 can be 15 micronsthick. FIGS. 1A and 2A illustrate an orientation marking 27. Suchmarkings can be used to identify the proper orientation of the diepackage 10 even after assembling the die package 10. The traces 22 and24, as illustrated, can extend from the mounting pad 28 to sides of thesubstrate 20.

Continuing to refer to FIGS. 1A through 2D, the substrate 20 definessemi-cylindrical spaces 23 and quarter-cylindrical spaces 25 proximal toits sides. In the Figures, to avoid clutter, only representative spaces23 and 25 are indicated with reference numbers. The semi-cylindricalspaces 23 and the quarter-cylindrical spaces 25 provide spaces forsolder to flow-through and solidify-in when the die package 10 isattached to a printed circuit board (PCB) or another apparatus (notshown) to which the die package 10 is a component thereof. Moreover, thesemi-cylindrical spaces 23 and the quarter-cylindrical spaces 25 provideconvenient delineation and break points during the manufacturingprocess.

The substrate 20 can be manufactured as one individual section of astrip or a plate having a plurality of adjacent sections, each sectionbeing a substrate 20. Alternatively, the substrate 20 can bemanufactured as one individual section of an array of sections, thearray having multiple rows and columns of adjacent sections. In thisconfiguration, the semi-cylindrical spaces 23 and quarter-cylindricalspaces 25 can be utilized as tooling holes for the strip, the plate, orthe array during the manufacturing process.

Furthermore, the semi-cylindrical spaces 23 and the quarter-cylindricalspaces 25, combined with scribed grooves or other etchings between thesections, assist in separating each individual substrate from the strip,the plate, or the wafer. The separation can be accomplished byintroducing physical stress to the perforation (semi through holes at aclose pitch) or scribe lines made by laser, or premolded, or etchedlines (crossing the semi-cylindrical spaces 23 and thequarter-cylindrical spaces 25) by bending the strip, the plate, or thewafer. These features simplify the manufacturing process and thus reducecosts by eliminating the need for special carrier fixtures to handleindividual unit of the substrate 20 during the manufacturing process.Furthermore, the semi-cylindrical spaces 23 and the quarter-cylindricalspaces 25 serve as via holes connecting the top solder pads 26, the sidesolder pads 32, and the bottom solder pads 34.

The substrate 20 has a bottom surface 29 including a thermal contact pad36. The thermal contact pad 36 can be fabricated using a material havinga high thermally and electrically conductive properties such as gold,silver, tin, or another material including but not limited to preciousmetals.

FIG. 3 illustrates a cut-away side view of portions of the semiconductorpackage of FIGS. 1A and 1B. In particular, the FIG. 3 illustrates acut-away side view of the top heat sink 40 and the lens 50. Referring toFIGS. 1A, 1B, and 3, the top heat sink 40 is made from a material havinghigh thermal conductivity such as aluminum, copper, ceramics, plastics,composites, or a combination of these materials. A high temperature,mechanically tough, dielectric material can be used to overcoat thetraces 22 and 24 (with the exception of the central die-attach area) toseal the traces 22 and 24 and provide protection from physical andenvironmental harm such as scratches and oxidation. The overcoatingprocess can be a part of the substrate manufacturing process. Theovercoat, when used, may insulate the substrate 20 from the top heatsink 40. The overcoat may then be covered with a high temperatureadhesive such as thermal interface material manufactured by THERMOSETthat bonds the substrate 20 to the top heat sink 40.

The top heat sink 40 may include a reflective surface 42 substantiallysurrounding the LED assembly 60 mounted on the mounting pad 28 (of FIGS.2A and 2C). When the top heat sink 40 is used to dissipate heatgenerated by the LED in the die package 10, it can be “top-mounted”directly onto an external heat sink by an adhesive or solder joint todissipate heat efficiently. In another embodiment, if heat has to bedissipated by either a compressible or non-compressible medium such asair or cooling fluid, the top heat sink 40 may be equipped with coolingfins or any feature that will enhance heat transfer between the top heatsink 40 and the cooling medium. In both of these embodiments, theelectrical terminals and the bottom heat sink 20 of the die package 10can still be connected to its application printed circuit board (PCB)using, for example, the normal surface-mount-technology (SMT) method.

The reflective surface 42 reflects portions of light from the LEDassembly 60 as illustrated by sample light rays 63. Other portions ofthe light are not reflected by the reflective surface 42 as illustratedby sample light ray 61. Illustrative light rays 61 and 63 are not meantto represent light traces often use in the optical arts. For efficientreflection of the light, the top heat sink 40 is preferably made frommaterial that can be polished, coined, molded, or any combination ofthese. Alternatively, to achieve high reflectivity, the opticalreflective surface 42 or the entire heat sink 40 can be plated ordeposited with high reflective material such as silver, aluminum, or anysubstance that serves the purpose. For this reason, the top heat sink 40is also referred to as a reflector plate 40. The reflector plate 40 ismade of material having high thermal conductivity if and when requiredby the thermal performance of the package 10.

In the illustrated embodiment, the reflective surface 42 is illustratedas a flat surface at an angle, for example 45 degrees, relative to thereflective plate's horizontal plane. The example embodiments are notlimited to the illustrated embodiment. For example, the reflectivesurface 42 can be at a different angle relative to the reflectiveplate's horizontal plane. Alternatively, the reflective plate can have aparabolic, toroid or any other shape that helps to meet the desiredspectral luminous performance of the package.

The reflective plate 40 includes a ledge 44 for supporting and couplingwith the lens 50. The LED assembly 60 is encapsulated within the diepackage 10 (of FIGS. 1A and 1B) using encapsulation material 46 such as,for example only, soft and elastic silicones or polymers. Theencapsulation material 46 can be a high temperature polymer with highlight transmissivity and refractive index that matches or closelymatches refractive index of the lens 50, for example. The encapsulant 46is not affected by most wavelengths that alter its light transmissivityor clarity.

The lens 50 is made from material having high light transmissivity suchas, for example only, glass, quartz, high temperature and transparentplastic, or a combination of these materials. The lens 50 is placed ontop of and adheres to the encapsulation material 46. The lens 50 is notrigidly bonded to the reflector 40. This “floating lens” design enablesthe encapsulant 46 to expand and contract under high and low temperatureconditions without difficulty.

For instance, when the die package 10 is operating or being subjected toa high temperature environment, the encapsulant 46 experiences greatervolumetric expansion than the cavity space that contains it. By allowingthe lens 50 to float up somewhat freely on top of the encapsulant 46, noencapsulant will be squeezed out of its cavity space. Likewise, when thedie package 10 is subjected to a cold temperature, the encapsulant 46will contract more than the other components that make up the cavityspace for the encapsulant 46; the lens will float freely on top of theencapsulant 46 as the latter shrinks and its level drops. Hence, thereliability of the die package 10 is maintained over relatively largetemperature ranges as the thermal stresses induced on the encapsulant 46is reduced by the floating lens design.

In some embodiments, the lens 50 defines a recess 52 (See FIG. 3) havinga curved, hemispherical, or other geometry, which can be filled withoptical materials intended to influence or change the nature of thelight emitted by the LED chip(s) before it leaves the die package 10.Examples of one type of optical materials include luminescenceconverting phosphors, dyes, fluorescent polymers or other materialswhich absorb some of the light emitted by the chip(s) and re-emit lightof different wavelengths. Examples of another type of optical materialsinclude light diffusants such as calcium carbonate, scattering particles(such as Titanium oxides) or voids which disperse or scatter light. Anyone or a combination of the above materials can be applied on the lens50 to obtain certain spectral luminous performance.

FIG. 4 illustrates the die package 10 coupled to an external heat sink70. Referring to FIG. 4, the thermal contact pad 36 can be attached tothe external heat sink 70 using epoxy, solder, or any other thermallyconductive adhesive, electrically conductive adhesive, or thermally andelectrically conductive adhesive 74. The external heat sink 70 can be aprinted circuit board (PCB) or other structure that draws heat from thedie package 10. The external heat sink can include circuit elements (notshown) or heat dissipation fins 72 in various configurations.

An example embodiment having an alternate configuration is shown inFIGS. 5 through 6D. Portions of this second embodiment are similar tocorresponding portions of the first embodiment illustrated in FIGS. 1Athrough 4. For convenience, portions of the second embodiment asillustrated in FIGS. 5 through 6D that are similar to portions of thefirst embodiment are assigned the same reference numerals, analogous butchanged portions are assigned the same reference numerals accompanied byletter “a,” and different portions are assigned different referencenumerals.

FIG. 5 is an exploded perspective view of an LED die package 10 a inaccordance with other embodiments of the present invention. Referring toFIG. 5, the light emitting die package 10 a of the present inventionincludes a bottom heat sink (substrate) 20 a, a top heat sink (reflectorplate) 40 a, and a lens 50.

FIGS. 6A, 6B, 6C, and 6D, provide, respectively, a top view, a sideview, a front view, and a bottom view of the substrate 20 a of FIG. 5.Referring to FIGS. 5 through 6D, the substrate 20 a includes one firsttrace 22 a and four second traces 24 a. Traces 22 a and 24 a areconfigured differently than traces 22 and 24 of FIG. 2A. The substrate20 a includes flanges 31 that define latch spaces 33 for reception oflegs 35 of the reflector plate 40 a, thereby mechanically engaging thereflector plate 40 a with the substrate 20 a.

Additional example embodiments are illustrated in FIGS. 7A through 10B.According to these embodiments, a substrate for a high power lightemitting device includes a thermally and electrically conductive platehaving first and second surfaces. The plate may comprise a metal such ascopper, aluminum or alloys of either. A thin, thermally conductiveinsulating film is formed on the first surface of the metal plate. Insome embodiments, the thermally conductive insulating film comprises aceramic/polymer film such as the Thermal Clad film available from by TheBergquist Company of Chanhassen, Minn., USA.

Conductive elements such as metal traces and/or metal leads may beformed on the ceramic/polymer film. Since the ceramic/polymer film isinsulating, the conductive traces are not in electrical contact with themetal plate. A conductive element may form or be electrically connectedto a mounting pad adapted to receive an electronic device. As discussedabove in connection with the embodiments illustrated in FIGS. 1-6, thetopology of the metal traces may vary widely while still remainingwithin the scope of the example embodiments.

An LED assembly may be bonded to the mounting pad for example by meansof soldering, thermo-sonic bonding or thermo-compression bonding. Heatgenerated by the LED may be dissipated at least in part through themetal plate. Since the substrate itself may act as a heat sink, the needfor bonding an additional heat sink to the structure may be reduced oreliminated. However, an additional heat sink may be placed in thermalcommunication with the metal plate so that heat may be drawn away fromthe operating device more efficiently.

In one embodiment, one or more via holes may be formed through theinsulating film and the metal plate. The via holes may be internallycoated with an insulating material such as the ceramic/polymer film.Electrical conductors such as electrically conductive traces may beformed in the via hole to electrically connect conductive elements onthe first surface of the substrate to conductive elements on the secondsurface of the substrate. A substrate according to such an embodimentmay be mounted on a surface such as a printed circuit board without theuse of metal leads, which may result in a more mechanically robustpackage.

A substrate according to example embodiments may also include electroniccircuitry such as a discrete zener diode and/or a resistor network forelectrostatic discharge (ESD) and/or over-voltage protection.

Although not illustrated in FIGS. 7-10, the substrate may furtherinclude features such as the semi-cylindrical and quarter-cylindricalspaces, orientation markings, side bond pads, flanges and other featuresillustrated in FIGS. 1-6.

Portions of the embodiments illustrated in FIGS. 7A through 10B aresimilar to corresponding portions of the embodiments illustrated inFIGS. 1 through 6D. For convenience, portions of the embodiment asillustrated in FIGS. 7A through 10B that are similar to portions of thefirst embodiment are assigned the same reference numerals, analogous butchanged portions are assigned the same reference numerals accompanied byletter “b,” and different portions are assigned different referencenumerals.

Referring now to FIG. 7A, a substrate 20 b according to anotherembodiments of the present invention is illustrated. FIGS. 7A and 7Bprovide, respectively, a top view and a front view of the substrate 20b. Further, FIG. 7B also shows an LED assembly 60 in addition to thefront view of the substrate 20 b. The substrate 20 b includes athermally and electrically conductive plate 51 having first and secondsurfaces 51 a and 51 b. The plate 51 may comprise a metal such ascopper, aluminum or alloys of either. A thin, thermally conductiveinsulating film 48 is formed on at least portions of the first surface51 a of the metal plate 51. In some embodiments, the thermallyconductive insulating film 48 comprises a ceramic/polymer film such asthe Thermal Clad film available from by The Bergquist Company ofChanhassen, Minn., USA. In addition, a thermally conductive insulatingfilm 49 may be formed on the second surface 51 b of plate 51, as well asside surfaces.

The substrate 20 b provides support for electrically conductive elementssuch as electrical traces 22 and 24; for solder pads 26; and for the LEDassembly 60. Further, additional traces and connections can befabricated on the top, side, or bottom of the substrate 20 b, or layeredwithin the substrate 20 b. The traces 22 and 24, the solder pads 26, andany other connections can be interconnected to each other in anycombinations using known methods, for example via holes.

The substrate 20 b has a top surface 21 b, the top surface 21 bincluding the electrical traces 22 and 24. The traces 22 and 24 provideelectrical connections from the solder pads (for example top solder pads26) to a mounting pad 28. The top solder pads 26 may comprise portionsof the traces 22 and 24 generally proximal to sides of the substrate 20b. The mounting pad 28 is a portion of the top surface (includingportions of the trace 22, the trace 24, or both) where the LED assembly60 is mounted. Typically the mounting pad 28 is generally locatedproximal to center of the top surface 21 b. In alternative embodimentsof the present invention, the LED assembly 60 can be replaced by othersemiconductor circuits or chips.

The topology of the traces 22 and 24 can vary widely from the topologyillustrated in the Figures while still remaining within the scope of theexample embodiments. In the Figures, only one cathode (negative) and oneanode (positive) trace is shown. However, multiple cathode or anodetraces may be included on the substrate 20 b to facilitate the mountingof plural LED assemblies on the mounting pad 28, each connected to adifferent cathode or anode trace; thus, the three LED assemblies may beseparately electrically controllable. The traces 22 and 24 are made ofconductive material such as gold, silver, tin, or other metals.

The substrate 20 b has a bottom surface 29 b including a thermal contactpad 36. The thermal contact pad can be fabricated using material havinghigh heat conductivity such as gold, silver, tin, or other materialincluding but not limited to precious metals.

FIG. 7C illustrates a cut-away front view of portions of the substrate20 b taken along section line A-A of FIG. 7A. As shown in FIG. 7C, oneor more via holes 45 a, 45 b may be formed through the substrate 20 b.The via holes 45 a, 45 b may be internally coated with an insulatingmaterial such as the ceramic/polymer film. Electrical conductors such aselectrically conductive traces 47 a, 47 b may be formed in the via holesand may electrically connect conductive elements on the first surface ofthe substrate to conductive elements on the second surface of thesubstrate. As illustrated in FIG. 7C, a conductive trace 47 a in viahole 45 a connects, trace 24 on the first side 21 b, or the top surface21 b, of the substrate 20 b to solder pad 34 on the second side 29 b, orthe bottom surface 29 b, of the substrate 20 b. Likewise, a conductivetrace 47 b extending through via hole 45 b connects conductive trace 22to a bond pad 38.

A substrate according to such an embodiment may be mounted on a surfacesuch as a printed circuit board without the use of metal leads, whichmay result in a more mechanically robust package.

As discussed above, a high temperature, mechanically tough, dielectricmaterial can be used to overcoat the traces 22 and 24 (with theexception of the central die-attach area 28) to seal the traces 22 and24 and provide protection from physical and environmental harm such asscratches and oxidation. The overcoating process can be a part of thesubstrate manufacturing process. The overcoat, when used, also insulatesthe traces 22 and 24 from the top heat sink 40. The overcoat may then becovered with a high temperature adhesive such as thermal interfacematerial manufactured by THERMOSET that bonds the substrate 20 b withthe top heat sink 40.

Other embodiments that do not utilize via holes are illustrated in FIGS.8 and 9. As illustrated in FIG. 8, the conductive traces 22, 24 may formor be attached to metal leads 39, 41 which extend away from the packageand which may be mounted directly to a circuit board. In such anembodiment, only the first surface 21 b of the substrate 20 b mayinclude an electrically insulating, thermally conductive film 48.

FIG. 9 illustrates an embodiment in which conductive traces 22, 24extend down the sidewalls of the substrate 20 b to contact bond pads 34and 38 on the second surface of the substrate 20 b. Such a configurationmay permit the package to be mounted directly onto a circuit boardwithout the use of metal leads or via holes.

As illustrated in FIGS. 10A and 10B, the substrate 20 b may beconfigured to include electronic circuitry such as a discrete zener 65diode, a resistor network 67, other electronic elements, or anycombination of these. Such electronic circuitry can be connected betweenthe traces 22 and 24 which may operate as anode/or cathode elements. Theelectronic circuitry can be used for various purposes, for example, toprevent electrostatic discharge (ESD), for over-voltage protection, orboth. In the illustrated examples, the zener diode D1 65 connectedbetween the trace 22 and the trace 24 as illustrated in FIG. 10B mayprevent an excessive reverse voltage from being applied to anoptoelectronic device mounted on the substrate 20 b. Similarly, theresistor network 67 such as printed resistor 67 may provide ESDprotection to a device mounted on the substrate 20.

The example embodiments of the present invention being thus described,it will be obvious that the same may be varied in many ways. Suchvariations are not to be regarded as a departure from the exemplaryembodiments of the present invention, and all such modifications aswould be obvious to one skilled in the art are intended to be includedwithin the scope of the following claims.

What is claimed is:
 1. A light emitting die package, comprising: asubstrate having a first surface; a first conductive lead on the firstsurface that is insulated from the substrate by an insulating film, thefirst conductive lead forming a mounting pad for mounting a lightemitting device; a lead electrically connected to the first conductivelead and extending away from the first surface; and a reflective surfacedisposed on the first surface of the substrate at least partially on topof the first conductive lead, the reflective surface substantiallysurrounding the mounting pad while leaving other portions of the firstsurface of the substrate and portions of the first conductive leadexposed.
 2. The package of claim 1, further comprising: a secondconductive lead, and a light emitting diode (LED) mounted on thesubstrate and connected to the first and second conductive leads.
 3. Thepackage of claim 2, wherein the LED is encapsulated within opticallyclear polymer.
 4. The package of claim 1, wherein the substratecomprises a metal selected from the group consisting of copper, aluminumand a copper/aluminum alloy.
 5. The package of claim 1, wherein theinsulating film comprises a ceramic polymer film.
 6. The package ofclaim 2, wherein the substrate comprises a second surface opposite thefirst surface, and further comprising at least one via hole through thesubstrate.
 7. The package of claim 6, wherein a surface of the via holeis coated with an insulating film coating.
 8. The package of claim 6,wherein the via hole includes a conductive trace there through, theconductive trace being insulated from the substrate by the insulatingfilm coating, being in electrical contact with one of the first andsecond conductive leads.
 9. The package of claim 1, wherein the leadelectrically connected to the first conductive lead extends away fromthe mounting pad and around a side of the substrate.
 10. The package ofclaim 1, wherein the reflective surface is disposed on a reflector thatcomprises at least one leg mechanically engaging the substrate forincreased thermal transfer.
 11. The package of claim 1, wherein thesubstrate comprises flanges along at least one side for mechanicallyengaging a reflector on which the reflective surface resides.
 12. Thepackage of claim 1, wherein the reflective surface comprises a materialhaving high thermal conductivity.
 13. The package of claim 1, furthercomprising: a lens substantially covering the mounting pad.
 14. Thepackage of claim 13, wherein the lens comprises a trough adapted toreceive optical chemicals.
 15. The package of claim 13, wherein the lenscomprises materials selected from the group consisting of frequencyshifting compounds, a diffusant, and a phosphor.
 16. A light emittingdie package comprising: a substrate; a first conductive element on thesubstrate; a second conductive element on the substrate, the secondconductive element spaced apart from the first conductive element and atleast one of the first and second conductive elements comprising amounting pad for mounting a light emitting die thereon; a reflectivesurface coupled to the substrate and substantially surrounding themounting pad and the reflective surface comprising a ledge; and anencapsulation material comprising an optically clear polymer forencapsulating the light emitting die, the encapsulation materialresiding within the reflective surface over the mounting pad and ledge;and a lens substantially covering the mounting pad and resting on theencapsulation material above the ledge of the reflective surface. 17.The light emitting die package of claim 16 further comprising a lightemitting diode (LED) mounted on the substrate and connected to the firstand second conductive elements.
 18. The light emitting die package ofclaim 16, wherein the first and second conductive elements comprisemetal traces.
 19. The light emitting die package of claim 16, whereinthe substrate comprises a metal selected from the group consisting ofcopper and aluminum.
 20. The light emitting die package of claim 16,wherein the substrate comprises a metal consisting of a copper/aluminumalloy.
 21. The light emitting die package of claim 16, wherein thesubstrate comprises a second surface opposite the first surface, andfurther comprising at least one via hole through the substrate.
 22. Thelight emitting die package of claim 16, wherein the surface of the viahole is coated with an insulating film coating.
 23. The light emittingdie package of claim 22, wherein the via hole comprises a conductivetrace therethrough, the conductive trace is insulated from the substrateby the insulating film coating, and the conductive trace is inelectrical contact with one of the first and second conductive elements.24. The light emitting die package of claim 23, wherein the secondsurface of the substrate comprises a thermally conductive insulatingfilm on at least a portion of the second surface and wherein the packagefurther comprises a third conductive element on the second surface, thethird conductive element is insulated from the substrate by thethermally conductive insulating film, and the third conductive elementis in electrical contact with the conductive trace through the via hole.25. The light emitting die package of claim 16, further comprising anexternal heat sink coupled to the substrate.
 26. The light emitting diepackage of claim 25, wherein the substrate has a bottom side plated withmetals for coupling with the external heat sink.
 27. The light emittingdie package of claim 16, wherein at least one conductive element extendsfrom the mounting pad to a side of the substrate.
 28. The light emittingdie package of claim 16, wherein the reflective surface resides on areflector that is coupled to the substrate.
 29. The light emitting diepackage of claim 28, wherein the substrate comprises flanges along atleast one side for mechanically engaging the reflector.
 30. The lightemitting die package of claim 28, wherein the reflector comprises amaterial selected from the group consisting of aluminum, copper,ceramics and plastics.
 31. The light emitting die package of claim 28,wherein the reflector comprises at least one leg mechanically engagingthe substrate for increased thermal transfer.
 32. The light emitting diepackage of claim 16, wherein the lens comprises diffusant.
 33. The lightemitting die package of claim 16, wherein the lens comprises a phosphor.